Author: Hans J. Greub
Publications
Publication period start: 1987
Number of co-authors: 4
Co-authors
Number of
publications with favourite co-authors
Productive Colleagues
Most productive
colleagues in number of publications
Publications
McDonald, Jack F., Greub, Hans J., Steinvorth, Randy H., Donlan, Brian J., Bergendahl, Albert S. (1987): Wafer Scale Interconnections for GaAs Packing - Applications to RISC Architecture. In IEEE Computer, 20 (4) pp. 21-35.