Author: William E. Burdick Jr.
Publications
Publication period start: 1993
Number of co-authors: 2
Co-authors
Number of
publications with favourite co-authors
Productive Colleagues
Most productive
colleagues in number of publications
Publications
Daum, Wolfgang, Jr., William E. Burdick, Fillion, Raymond A. (1993): Overlay High-Density Interconnect: A Chips-First Multichip Module Technology. In IEEE Computer, 26 (4) pp. 23-29.